There's a project I've been working on: put a DIP z80 into a TI-83+.
There's a couple things that are easier with full-size logic:
- making blinkenlights
- making a front panel
- messing with the address space so that things like cp/m could run
- adding IO ports (real serial port, more GPIO, etc)
Anyway, here's the semi-finished product:
(sending an OS was of course the first thing I did because I'm definitely sure it's stable and not at all going to break on some weird flash thing)
And the two sides of the back:
As Runer112 pointed out on IRC, it "looks eerily like actual surgery"
Every other wire in those bundles is a ground wire. Before, I had tried this without the ground wires, and crosstalk was unsurprisingly the biggest issue. I used 80-pin IDE cable for the wires, which worked pretty well. I would have preferred something with a little higher melting point on the insulation, though. The yellow tape is kapton tape, to prevent any parts of the wires which had de-insulated from touching the board.
There's a couple things that are easier with full-size logic:
- making blinkenlights
- making a front panel
- messing with the address space so that things like cp/m could run
- adding IO ports (real serial port, more GPIO, etc)
Anyway, here's the semi-finished product:
(sending an OS was of course the first thing I did because I'm definitely sure it's stable and not at all going to break on some weird flash thing)
And the two sides of the back:
As Runer112 pointed out on IRC, it "looks eerily like actual surgery"
Every other wire in those bundles is a ground wire. Before, I had tried this without the ground wires, and crosstalk was unsurprisingly the biggest issue. I used 80-pin IDE cable for the wires, which worked pretty well. I would have preferred something with a little higher melting point on the insulation, though. The yellow tape is kapton tape, to prevent any parts of the wires which had de-insulated from touching the board.